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Specification of Eastcom Thermal CTP DX1160 System
Model: DX1160
Exposure Structure: External drum
Laser system: Infrared lasers, 64 channels, wavelength 830nm
Plate size: Max. 1130mm×900mm ; Min. 510mm×400mm
Applicable plate: Thermal plate(infrared 830nm )
Plate thickness: 0.15 mm~0.4 mm
Resolution: 2540dpi
Max hanged line: 300lpi
FM dots output: 20 μm
Repeatability: ±0.01mm
Output speed(plate loading and unloading time included): >25 P/h(2540dpi, plate size 1030mm*800mm)
Plate loading & unloading: Semi-automatic, double plate bed, separate loading and
unloading, continuous plate-loading available
On-line punch system: customizable
Dust control system: independent dust removal system keep the laser units clean and
reliable output quality
Operational condition: without any dark room
Recommended Environmental requirements: Temperature 23℃±2℃/humidity 40%-70%
Measurement:(L*W*H): 1380mm*2600mm*1150mm
N.W.:1600KG
Exposure Structure: External drum
Laser system: Infrared lasers, 64 channels, wavelength 830nm
Plate size: Max. 1130mm×900mm ; Min. 510mm×400mm
Applicable plate: Thermal plate(infrared 830nm )
Plate thickness: 0.15 mm~0.4 mm
Resolution: 2540dpi
Max hanged line: 300lpi
FM dots output: 20 μm
Repeatability: ±0.01mm
Output speed(plate loading and unloading time included): >25 P/h(2540dpi, plate size 1030mm*800mm)
Plate loading & unloading: Semi-automatic, double plate bed, separate loading and
unloading, continuous plate-loading available
On-line punch system: customizable
Dust control system: independent dust removal system keep the laser units clean and
reliable output quality
Operational condition: without any dark room
Recommended Environmental requirements: Temperature 23℃±2℃/humidity 40%-70%
Measurement:(L*W*H): 1380mm*2600mm*1150mm
N.W.:1600KG
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